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Introduction
2012 IEEE Electrical
Design of Advanced Packaging and Systems Symposium
(EDAPS) has been one of main events in Asia Pacific region that attract world class designers and researchers to share their state-of-the-art results related to modeling, simulation, and measurement for the electrical design issues on chip, package and system levels. The symposium consists of paper presentations, industry exhibitions, workshops, and tutorials. The 2012 EDAPS will be held in Taiwan from December 9 to 11, 2012. The technical program of the symposium not only addresses the current technical issues but also brings out the challenges facing IC design, SiP/SoP packaging, EMI/EMC, EDA tools, and most importantly the challenges in next generation 3DIC and packaging design.
Taiwan is famous as a
Silicon Island, which has been playing a leading role in the design and fabrication service in chips, packages, and boards. A knowledge sharing platform with strong interaction between academia and industry will be highly expected in EDAPS 2012.
Topics
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3DIC / 3D-Stacked IC
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Testing on 3DIC and SiP
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Substrate Technology
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Power Integrity / Ground Noise
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Time/Frequency Domain Measurement Techniques
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SiP/SoP
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Embedded Device Substrate
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Electromagnetic Compatibility (EMC)
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Design and Modeling for High-speed Channels and Interconnects
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Package Reliability
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RF/mmW Circuit Package
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Advanced Simulation Tools and CAD
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Signal Integrity
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Others
Secretariat
Yen Tjing Ling Industrial Research Institute
National Taiwan University
Email: ctshih@tl.ntu.edu.tw
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